Influence of adhesion of silica and ceria abrasive nanoparticles on Chemical-Mechanical Planarization of silica surfaces

Article ID	Journal	Published Year	Pages	File Type
5363654	Applied Surface Science	2011	7 Pages	PDF

Abstract

âº New AFM method to measure adhesion between nanoparticles and surfaces developed. âº Adhesion between abrasive nanoparticles of irregular shape and silica surface measured. âº The method is applied to the process of Chemical-Mechanical Planarization (CMP). âº Correlations between adhesion and CMP removal rate and defectivity are analyzed.

Keywords

Defectivity Atomic Force Microscopy (AFM)Silica nanoparticles Ceria nanoparticles Removal rate Adhesion

Related Topics

Physical Sciences and Engineering Chemistry Physical and Theoretical Chemistry

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Influence of adhesion of silica and ceria abrasive nanoparticles on Chemical-Mechanical Planarization of silica surfaces

Authors

D.O. Volkov, P.R Veera Dandu, H. Goodman, B. Santora, I. Sokolov,