Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5363943 | Applied Surface Science | 2008 | 6 Pages |
Abstract
Three-dimensional molecular dynamics simulations of AFM-based nanometric cutting monocrystalline copper with pin tool radius of 0.713Â nm are performed to investigate the effect of uncut chip thicknesses (0.1805Â nm, 0.361Â nm, 0.5415Â nm, 0.722Â nm, 0.9025Â nm, 1.0875Â nm, and 1.268Â nm) on the depth of subsurface deformed layers. The EAM potential and Morse potential are utilized respectively to compute the interactions between workpiece atoms, the interactions between workpiece atoms and tool atoms. The single-atom potential energy variations of the workpiece atoms within the subsurface regions during the cutting process are obtained and analyzed through a deformation criterion to determine the deformation behaviors of subsurface atoms. The simulation results reveal that the depth of subsurface deformed layers is affected by the AFM pin tool's rake angle. At each uncut chip thickness, the AFM pin tool presents different negative rake angles, consequently different degrees of deformation in the subsurface take place.
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Authors
J.J. Zhang, T. Sun, Y.D. Yan, Y.C. Liang, S. Dong,