| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5363997 | Applied Surface Science | 2011 | 5 Pages |
Abstract
⺠A novel method for electroless copper deposition on glass material is reported. ⺠The formation of modified-glass substrate is confirmed. ⺠The surface morphology of the electroless plated copper film is characterized. ⺠The chemical composition of the copper-metalized glass surface is determined.
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Wei Su, Libei Yao, Fang Yang, Peiyuan Li, Juan Chen, Lifang Liang,