| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5364187 | Applied Surface Science | 2012 | 9 Pages |
Abstract
⺠Ni-W-Pyr coatings were homogeneous with finer grain size with dendrites. ⺠Ni-W-Pyr contains about 11% of W when it is only 0.1% for Ni-W coatings. ⺠Ni-W-Pyr deposits improve electrical, mechanical and electrochemical properties of Cu. ⺠Ni-W films obtained from pyridine bath improved better stability into 3% NaCl. ⺠Pyridine has been not only adsorbate onto the Ni-W layer but also through it.
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Authors
W. Sassi, L. Dhouibi, P. Berçot, M. Rezrazi, E. Triki,