Article ID Journal Published Year Pages File Type
5366307 Applied Surface Science 2006 4 Pages PDF
Abstract
The difference in the response of the two sample types to post deposition thermal treatment can be tracked back to the de-wetting behavior of Cu on the different substrates. Void formation is observed at the Cu-C interface in the case of plasma treatment but not for samples with a Mo-interlayer.
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Related Topics
Physical Sciences and Engineering Chemistry Physical and Theoretical Chemistry
Preview
Modification of wetting of copper (Cu) on carbon (C) by plasma treatment and molybdenum (Mo) interlayers
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