Electrodeposition of Pb-free Sn alloys in pulsed current

A pulsed electrodeposition method is applied to the preparation of Pb-free Sn alloys solder bumps for flip-chip bonding with the aid of a photolithography. Sn-Ag alloy films with near eutectic compositions (Sn-3.5% Ag) were obtained using a pyrophosphate-iodide plating baths regardless under direct or pulsed current. The composition and the morphology of electrodeposits were examinated by SEM and X-ray photoelectron spectroscopy (XPS). The main results revealed that the organic additives affect the electrochemical reduction of tin-silver and the direct consequence on making Sn-Ag alloy is a decreased deposition rate. However, the addition of additives in the plating bath suppressed the dendritic tin-silver growth by adsorption on the deposited surface. Pulsed electrodeposition is shown to be an interesting approach to elaborate bumps with smooth and homogeneous surfaces.