Surface adhesion and demolding force dependence on resist composition in ultraviolet nanoimprint lithography

Demolding, the process to separate stamp from molded resist, is most critical to the success of ultraviolet nanoimprint lithography (UV-NIL). In the present study we investigated adhesion and demolding force in UV-NIL for different compositions of a model UV-curable resist system containing a base (either tripropyleneglycol diacrylate with shorter oligomer length or polypropyleneglycol diacrylate with longer oligomer length), a cross-linking agent (trimethylolpropane triacrylate) and a photoinitiator (Irgacure 651). The demolding force was measured using a tensile test machine with homemade fixtures after imprinting the UV resist on a silicon stamp. While decreasing the cross-linking agent content from 49 to 0 wt% has little effect on the resist surface energy, it reduces the resist's elastic modulus drastically. The decrease in elastic modulus results in a decreased adhesion force at the resist/stamp interface thereby facilitating the demolding. The decrease in elastic modulus and, therefore, demolding force by lowering the cross-linking agent content was markedly less pronounced in tripropyleneglycol diacrylate-based resists due to its shorter oligomer length. These general findings will be useful in designing new resists for UV-NIL process.

► Two similar UV curable oligomers with only different chain lengths were used. ► Oligomers were mixed with various amounts of cross-linking agent. ► Decreasing the cross-linking agent content lowers the Young's modulus of the resist. ► A lower Young's modulus results in a lower surface adhesion force. ► Young's modulus and surface adhesion dependence on the cross-linking agent content is stronger when a longer chained oligomer was used.