Article ID Journal Published Year Pages File Type
5367880 Applied Surface Science 2008 4 Pages PDF
Abstract

Copper nitride thin films were deposited on Si (1 0 0) wafers by reactive magnetron sputtering at various H2/N2 ratios. X-ray diffraction measurements show that the films are composed of Cu3N crystallites with anti-ReO3 structure and exhibit preferred orientation of [1 0 0] direction. Although the relative composition of the films has obviously changes with the H2/N2 ratios, the orientations of the films keep almost no changes. However, the grain size, lattice parameter and composition of the films are strongly dependent on the H2/N2 ratios. The copper nitride films prepared at 10% H2/N2 ratios show poor stability and large weight gain compared to the copper nitride films prepared at 0% H2/N2 ratios.

Related Topics
Physical Sciences and Engineering Chemistry Physical and Theoretical Chemistry
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