Article ID Journal Published Year Pages File Type
5368109 Applied Surface Science 2011 5 Pages PDF
Abstract
▶ High density Cu/Sn micro-bumps electrodepositing. ▶ Electrolyte is hard to reach up to the bottom of micro-hole. ▶ Under mechanical action, void free micro-bumps was achieved with depth of 60 μm and radius of 30 μm. ▶ A model shows wetting process of electrolyte.
Related Topics
Physical Sciences and Engineering Chemistry Physical and Theoretical Chemistry
Preview
Wetting process of electrolyte in high density Cu/Sn micro-bumps electrodepositing
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