Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5369909 | Applied Surface Science | 2006 | 5 Pages |
Abstract
A thin polycrystalline film bonded tightly to a thick substrate of different thermal expansion coefficients will experience thermal strain when the temperature is changed. Calculations of the strain energies for grains having various crystallographic orientations (h k l) relative to the film surface were made for a polycrystalline film composed of the close-packed hexagonal (HCP) metal Be, Cd, Co, Hf, Mg, Re, Ru, Sc, Ti, Y, Zr and Zn, respectively. From strain energy minimization, the (0 0 1), (0 1 3), (0 4 5), (1 2 3), (2 5 8), (0 5 7), (0 3 5), (0 5 7), (0 1 0), (5 5 8), (1 4 7) and (0 0 1) textures should be favorable in Be, Cd, Co, Hf, Mg, Re, Ru, Sc, Ti, Y, Zr and Zn film, respectively.
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Jian-Min Zhang, Yan Zhang, Ke-Wei Xu, Vincent Ji,