Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5370517 | Applied Surface Science | 2005 | 6 Pages |
Abstract
The effect of Ni interlayer on stress level of cobalt silicides was investigated. The X-ray diffraction patterns (XRD) show that low temperature formation of Co1âxNixSi2 solid solution was obtained while Ni interlayer was present in Co/Si system, which was confirmed by Auger electron spectrum (AES) and sheet resistance measurement. XRD was also used to measure the internal stress in CoSi2 films by a 2θÏ â sin2Ï method. The result shows that the tensile stress in CoSi2 films evidently decreased in Co/Ni/Si(1 0 0) system. The reduction of lattice mismatch, due to the presence of Ni in CoxNi1âxSi2 solid solution, is proposed to explain this phenomenon.
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Authors
K. Ma, J.Y. Feng,