| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5383514 | Chemical Physics Letters | 2012 | 5 Pages |
Abstract
⺠Ideal collisions of a Cu asperity with a flat Sn surface are numerically studied. ⺠Material transfer from the Sn crystal to the Cu one takes place. ⺠Size and temperature govern the possible melting of the transferred Sn domains. ⺠At melting, Cu atoms dissolve into molten Sn.
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Francesco Delogu,