Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy

The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn have been determined to be (8.7 ± 0.6) × 10−8 Km, (113.1 ± 13.6) × 10−3 J m−2 and (222.4 ± 28.9) × 10−3 J m−2, respectively. The thermal conductivity of solid phase and the thermal conductivity ratio of liquid phase to solid phase for Sn-1.3 at.%Cu alloy have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively.

Graphical abstractThe thermal conductivity, Gibbs-Thomson coefficient and interfacial energies of solid Sn in the Sn-Cu alloy have been determined.Download high-res image (67KB)Download full-size image