| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5394780 | Computational and Theoretical Chemistry | 2012 | 5 Pages |
Abstract
⺠Neat 2:1 urea-choline chloride has low concentrations of urea anions. ⺠Binding of the urea anion to CuO is significantly greater than binding with the neutral urea. ⺠The significant increase in anion binding could drive the formation of the anion in solution. ⺠This DES becomes more aggressive in the presence of the urea anion leading to etching of metallic Cu. ⺠Binding trends of the chloride anion is opposite that of the urea neutral preferring Cu to CuO.
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Jessica M. Rimsza, L. René Corrales,