Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5420010 | Progress in Surface Science | 2013 | 29 Pages |
Abstract
⺠We simultaneously measure intermetallic volume, stress and whisker density leading to Sn whiskers. ⺠Stress from the growth of Sn-Cu intermetallic is the main driving force for whiskers. ⺠Rapid grain boundary diffusion spreads the stress across the Sn layer. ⺠Electron microscopy and backscattering reveal which sites are most prone to whiskering. ⺠Whiskers nucleate at “weak” sites on the surface such as horizontal grain boundaries.
Related Topics
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Authors
Eric Chason, Nitin Jadhav, Fei Pei, Eric Buchovecky, Allan Bower,