Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5421946 | Surface Science | 2015 | 11 Pages |
Abstract
We present detailed in situ surface x-ray scattering studies of homoepitaxial Cu electrodeposition on Cu(001) electrodes in electrolytes containing chloride and 1Â mM or 5Â mM Cu(ClO4)2. By time-resolved measurements, insight into the underlying atomic-scale processes is gained up to growth rates of 38Â ML/min, revealing a pronounced mutual interaction of the Cl adlayer order and Cu growth behavior. At the lower potential limit, where the Cl adlayer is disordered, step-flow growth is observed. Towards more positive potentials, in the regime of the c(2Â ÃÂ 2) Cl adlayer phase, transitions to layer-by-layer and then 3D growth are found. In turn, the kinetics of the c(2Â ÃÂ 2) Cl adlayer ordering during Cu deposition is substantially slowed down as compared to Cu-free solution. Furthermore, from a detailed analysis of the anti-Bragg peak shape during layer-by-layer growth, an oscillatory average strain in the surface layer is deduced, which is tentatively rationalized by a model considering strain induced by step edges and adatoms.
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Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
F. Golks, Y. Gründer, J. Stettner, K. Krug, J. Zegenhagen, O.M. Magnussen,