Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5439091 | Ceramics International | 2017 | 7 Pages |
Abstract
In the field of microelectronics housings made of corundum or sapphire are used, because they resist high mechanical stresses and can be used in extreme environments. For joining these components, sealing materials are necessary, which have a thermal expansion coefficient adapted to corundum or sapphire (8.2Ã10 â6Kâ1) and resist high temperature. This can be achieved by glass, which is crystallized during the joining process. However, the temperatures in conventional joining processes are not suitable for the encapsulation of temperature “sensitive components”. During a laser joining process only the joining zone is heated up for a short period of time and the components were not destroyed. For this process glasses from the system CaO/MgO/Al2O3/SiO2 were chosen and analyzed with respect to their sintering and crystallization behavior. The glasses could be sintered and crystallized by using the laser joining process. The crystallized glasses have a thermal expansion coefficient between 8.1Ã10 â6 Kâ1 and 9.3Ã10â6Â Kâ1 and hence, show a good match for joining of corundum and sapphire.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Franziska Döhler, Tilman Zscheckel, Susanne Kasch, Thomas Schmidt, Christian Rüssel,