Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5439404 | Composites Part A: Applied Science and Manufacturing | 2017 | 28 Pages |
Abstract
The proposed combining method of silane coupling agent of γ-aminopropyl triethoxy silane/aminopropyllsobutyl polyhedral oligomeric silsesquioxane (KH-560/NH2-POSS) was performed to functionalize the surface of hexagonal nanometer boron nitride fillers (f-nBN), aiming to fabricate the f-nBN/polyphenylene sulfide (f-nBN/PPS) nanocomposites with excellent thermal conductivities, outstanding thermal stabilities and optimal dielectric properties. The usage of f-nBN fillers was benifit for improving the thermally conductive coefficient (λ) and decreasing dielectric constant (ε) values of the PPS nanocomposites. The f-nBN/PPS nanocomposite with 60 wt% f-BN fillers was an excellent dielectric nanocomposite with high λ & ideal ε values and outstanding thermal stability, λ of 1.122 W/m K (increased by 400% compared to that of pristine PPS matrix), ε of 3.99 and THeat-resistance index (THRI) beyond 275 °C, which holds potential for electronic packaging materials and ultra high voltage electrical apparatus.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Xutong Yang, Lin Tang, Yongqiang Guo, Chaobo Liang, Qiuyu Zhang, Kaichang Kou, Junwei Gu,