| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5440107 | Corrosion Science | 2016 | 38 Pages |
Abstract
The corrosion behavior of ternary Sn-9Zn-0.1X (X = Ni, Cr, Cu and Ag) solder alloys were investigated by electrochemical techniques and surface characterization, aiming to explore the effects of intermetallic-forming elements on the corrosion resistance. Zn-rich precipitates in the modified alloys were suppressed and refined by formation of Zn-containing intermetallic compounds. As a result, the corrosion resistance improved markedly with addition of these elements, and the potency to suppress anodic dissolution increased in the order of Ag < Cu < Cr < Ni. Such improvement was discussed in terms of refined Zn-rich precipitates and enhanced passive film stability.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Jian-Chun Liu, Zheng-Hong Wang, Jing-Yang Xie, Ju-Sheng Ma, Qing-Yu Shi, Gong Zhang, Katsuaki Suganuma,