Incorporation of SiO2 and TiO2 additives into expanded polystyrene foam using physical vapour deposition technique

This article analyses possibility to use physical vapour deposition (PVD) technique for incorporation of pure SiO2 and TiO2 additives into thermal sensitive polymer (expanded polystyrene). SiO2 and TiO2 films were deposited on non-expanded polystyrene (PS) beads. These beads were expanded and molded into one piece foam (expanded polystyrene (EPS)). During the expansion process, SiO2 and TiO2 films were fractured. SiO2 / TiO2 films after expansion were distributed with even regions around the expanded PS beads. Results showed that fractured SiO2 and TiO2 films were observed on EPS foam without any impurities. Such method could be used for pure additives incorporation into polymers, where relatively homogenous distribution of additives in the polymer bulk is required.