Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5444605 | Energy Procedia | 2017 | 6 Pages |
Abstract
As major degradation indicator the performance of the modules containing conductive adhesives, redundant fingers and groove structured interconnectors is measured before and after the exposition of the solar module to different accelerated ageing tests and compared to the reference solar module with flat interconnectors soldered on busbars. After the accelerating ageing test damp heat (DH), there was already a clear difference in viability of the conductive adhesives. For two conductive adhesives, module power losses were comparable to the reference, for a third one power losses amounted to 14 %. The loss in power is caused by an increase in serial resistance. Analyses of the adhesives indicate a relation between the degradation in damp-heat and the adsorption of humidity of the material. Different subsequent aging tests (after DH) showed the feasibility of this innovative technology, but also unveiled weaknesses compared to a traditional soldered busbar technology. Two of the three conductive adhesives have fulfilled the IEC 61215 criteria in terms of power loss after damp heat, humidity freeze and thermal cycling.
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Energy (General)
Authors
Luciana Pitta Bauermann, Esther Fokuhl, Sandor Stecklum, Daniel Philipp, Torsten Geipel, Achim Kraft, Ulrich Eitner, Thomas Fischer, Dieter Breitenbücher,