Article ID Journal Published Year Pages File Type
5455100 Materials Science and Engineering: A 2017 28 Pages PDF
Abstract
The initiation and propagation of microcracks in the copper thin film on flexible polyimide substrates was examined through the thickness direction following cyclic bending test using a focused ion beam (FIB) and electron backscatter diffraction (EBSD) technique. The EBSD observations of the cross-sectional plane clearly indicated that intergranular fracture was predominant during the initiation and propagation of microcracks. During the cyclic bending testing, through the thickness direction microcracks were propagated mostly along the high-angle grain boundaries (HAGBs) that separated the neighboring grains with a high Schmid factor (SF), instead of at the twin boundaries (TBs).
Related Topics
Physical Sciences and Engineering Materials Science Materials Science (General)
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