Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5455100 | Materials Science and Engineering: A | 2017 | 28 Pages |
Abstract
The initiation and propagation of microcracks in the copper thin film on flexible polyimide substrates was examined through the thickness direction following cyclic bending test using a focused ion beam (FIB) and electron backscatter diffraction (EBSD) technique. The EBSD observations of the cross-sectional plane clearly indicated that intergranular fracture was predominant during the initiation and propagation of microcracks. During the cyclic bending testing, through the thickness direction microcracks were propagated mostly along the high-angle grain boundaries (HAGBs) that separated the neighboring grains with a high Schmid factor (SF), instead of at the twin boundaries (TBs).
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Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Atanu Bag, Shi-Hoon Choi,