Article ID Journal Published Year Pages File Type
5455399 Materials Science and Engineering: A 2017 17 Pages PDF
Abstract
The grain morphology evolution and mechanical strength change of the intermetallic joints formed in a Ni/Sn/Cu system by the transient liquid phase (TLP) soldering at 260 °C, 300 °C and 340 °C were investigated. The grain morphology evolution of the (Cu, Ni)6Sn5 intermetallic compounds (IMCs) was highly correlated with the Ni concentration gradient across the joints and strongly affected by the soldering temperatures, which was analyzed in detail from the aspect of thermodynamics. The shear strengths of the three types of intermetallic joints were 49.8 MPa, 50.3 MPa and 42.7 MPa, respectively. The correlation between the grain morphology evolution and the mechanical strength change of the intermetallic joints was revealed.
Related Topics
Physical Sciences and Engineering Materials Science Materials Science (General)
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