Article ID Journal Published Year Pages File Type
5455524 Materials Science and Engineering: A 2017 9 Pages PDF
Abstract
In this study, the viscoplastic creep behaviors of the Sn-4Ag/Cu, Sn-3Cu/Cu and Sn-58Bi/Cu solder joints under shear stress were in-situ observed, and the evolutions in microstructure of the solders were characterized by in-situ EBSD. The results reveal that the creep strain of the Sn-Cu and Sn-Ag solders increase linearly with increasing time. Deformation of the Sn-Cu solder concentrates in some parallel shear bands, while deformation of the Sn-Ag solder is relatively uniform, and the deformation concentration along the joint interface is not obvious for the two solders. The strain concentration around the fine Ag3Sn particles in the Sn-Ag solder is not obvious, while the strain concentration around the large Cu6Sn5 grain in the Sn-Cu solder is serious and result in fracture of the Cu6Sn5 grain. Dynamic high-temperature recovery occurs in the Sn-Ag and Sn-Cu solders, result in grain boundary migration, polygonization and formation of a few low-angle grain boundaries. The Sn-Bi solder deforms through grain boundary sliding and phase boundary sliding, the strain increase exponentially with increasing time, and its grain structure is stable during the deformation process.
Related Topics
Physical Sciences and Engineering Materials Science Materials Science (General)
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