| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5456319 | Materials Science and Engineering: A | 2017 | 7 Pages |
Abstract
In this work, Cu6Sn5 nanoparticles in dimension of 10Â nm are synthesized and first applied to improve the SnBi solder alloys. The microstructure, tensile properties, creep behavior and corrosion resistance of the composite solder are all investigated. Furthermore, solder with 0.05Â wt% Cu6Sn5 nanoparticles presents the best performance among all the samples. Addition of Cu6Sn5 nanoparticles refines the microstructure of SnBi solder. Comparing with the pure sample, tensile properties of the composite one perform a brittle to ductile change. The nanoindentation test reveals that the creep resistance of SnBi-Cu6Sn5 samples is enhanced through the creep mechanism transformation. In corrosion experiments, samples with nanoparticles exhibit a lower corrosion rate. This reinforcement from nanoparticles of intermetallic compounds will provide us a new cognition in solder micro-alloying.
Related Topics
Physical Sciences and Engineering
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Materials Science (General)
Authors
Xuezheng Li, Yong Ma, Wei Zhou, Ping Wu,