| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5456639 | Materials Science and Engineering: A | 2017 | 5 Pages |
Abstract
Fusing of bonding interface which could lead to the combination of grains at the both sides of bonding interface, and transition of bonding interface into grain boundary occurred during heating. Both they could strengthen interface bonding, and interface bonding strength was more than doubled after heating for 6Â h.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Xiang Wang, Ren-Guo Guan, Ying-Qiu Shang, Wei Wang, Ning Wang,