Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5457991 | International Journal of Refractory Metals and Hard Materials | 2017 | 5 Pages |
Abstract
X-ray diffraction was utilized to examine the WC/Co surface after high spindle speed grinding (HSSG) to get a further insight into the machining induced surface damage mechanism. The results showed that grinding induced reorientation and preferred {100}/{10Â â10} growth of WC particles occurred in the deformed surface, while the crystallinity of WC(001) increased. Based on the analysis of the penetration depth of X ray in WC and Co, grazing incidence X-ray diffraction (GIXRD) showed that the grinding induced preferred crystal growth occurred only in the outmost layer (~Â 3.324Â nm), but the compressive stress was caused to a certain depth of the subsurface (>Â 756.18Â nm).
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Quanli Zhang, Qingliang Zhao, Suet To, Bing Guo,