Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5460576 | Journal of Alloys and Compounds | 2017 | 6 Pages |
Abstract
As a new preparation technique, selective laser melting (SLM) is applied to fabricate an electronic packaging candidate material, i.e., the Al-50Si alloy. The microstructures of the as-cast and the SLM Al-50Si alloys are investigated. The influences of solid solubility on the coefficient of thermal expansion (CTE) of the as-SLM and the heat-treated alloys are investigated. The primary Si can be significantly modified after SLM processing. Moreover, a CTE peak can be observed for the SLM alloy due to the formation of a supersaturated Al(Si) solid solution, which disappears after heat treatment due to Si precipitation. Furthermore, the relationship and differences between theoretical models and the experimentally determined CTE for the Al-50Si alloy will be discussed.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Y.D. Jia, P. Ma, K.G. Prashanth, G. Wang, J. Yi, S. Scudino, F.Y. Cao, J.F. Sun, J. Eckert,