Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5462625 | Materials Letters | 2018 | 12 Pages |
Abstract
The poor dispersion of carbon nanotubes (CNTs) in a copper matrix and the weak interfacial bonding between CNTs and the Cu matrix critically hinders the engineering applications of their composites. Herein, we obtained a well-dispersed and tight interfacial bonding between CNTs and Cu matrix in the Cu/CNTs composites fabricated via spark plasma sintering and subsequently hot rolling. Microstructural characterization shows that the small grain size of Cu matrix, the uniform dispersion of CNTs, and the good wettability and interfacial bonding between the CNTs and Cu significantly improved the mechanical properties of the Cu/CNTs composite. This work provides an innovative fabrication process for the development of high performance Cu/CNTs composites with excellent interfacial bonding strength.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Hui Deng, Jianhong Yi, Chao Xia, Yi Yi,