| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5462889 | Materials Letters | 2017 | 10 Pages |
Abstract
The low temperature fast solution annealing (FSA) concept is used for the deposition of perovskite film. In this simple method, a spin coated perovskite film was subsequently immersed into hot (80 °C) anti-solvent chlorobenzene. For this solution annealing process, sophisticated lab facility is not required to prevent humidity and moisture. Performance of devices, fabricated by FSA method using methylammonium lead iodide (MAPbI3) perovskite with two different hole transport materials (HTMs), was investigated. The power conversion efficiency (PCE) obtained for copper(I) thiocyanate (CuSCN) and 2,2â²,7,7â²-tetrakis[N,N-di(4-methoxyphenyl)amino]-9,9â²-spirobifluorene (Spiro-OMeTAD) HTMs were 10.02% and 12.10%, respectively.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Govindhasamy Murugadoss, Rangasamy Thangamuthu, Manavalan Rajesh Kumar, Sakkarapalayam Murugesan Senthil Kumar, Vijayakumar Prabu,