| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5462949 | Materials Letters | 2017 | 10 Pages |
Abstract
93W and Mo1 were bonded with and without Cu interlayer by plasma activated sintering. The bonding temperature was decreased greatly with Cu interlayer. Shear strength of 93W/Cu foil/Mo1 and 93W/Cu film/Mo1 were 148.4Â MPa and 193.3Â MPa, respectively. Elements were fully diffused at 93W/Cu and Cu/Mo1 interfaces. Fe-Ni binder in 93W alloy has a sound diffusion with Cu interlayer, and Ni enriched in diffusion interface and formed Cu-Ni alloy at the interface of the 93W/Cu film/Mo1 joint, which led to the increasing in bonding strength of joints greatly.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Mei Rao, Lianmeng Zhang, Jian Zhang, Guoqiang Luo, Qiang Shen,