Article ID Journal Published Year Pages File Type
5463539 Materials Letters 2017 9 Pages PDF
Abstract
Present work investigates the effect of long-term annealing at low homologous temperature (~0.22 Tm) on creep behaviour of pure copper (99.99%) processed by equal-channel angular pressing (ECAP). Coarse-grained pure copper was processed by 1 and 8 ECAP passes at room temperature. The ECAP-processed specimens were annealed at room temperature for 3 years. Microstructures of ECAP-processed specimens and their room temperature-annealed states were investigated by electron back scatter diffraction (EBSD) technique. Tensile tests were performed at room temperature under constant rate and at 373 K in creep under constant load. It was found that long-term annealing at room temperature led to occurrence of large grains in microstructure which influenced the strength. The influence grew with number of ECAP passes.
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Physical Sciences and Engineering Materials Science Nanotechnology
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