Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5465553 | Surface and Coatings Technology | 2017 | 8 Pages |
Abstract
Al/50Â vol% diamond composites are fabricated by hot pressing with the assistance of partial liquid phase for favoring densification through the addition of elemental copper. Copper is introduced by pure powder and secondary deposited coating (a tungsten based layer is coated directly on the surface of diamond particles), respectively. The results show that density, bending strength and thermal conductivity of Al/diamond composites are improved when the liquid phase forms homogeneously in the matrix. As copper powder is added, the liquid phase spreads through the particle boundaries under the applied press during sintering, finally fills the interfaces and voids. While as copper coating is conducted, a better densification capacity and more enhanced properties of the composites are received. Moreover, a theoretical model is proposed to estimate the effect of different copper addition routes on thermal conductivity of the composites, and the results show a good agreement with the experimental data.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Chun Zhang, Zhiyong Cai, Richu Wang, Chaoqun Peng, Yan Feng,