| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5465643 | Surface and Coatings Technology | 2017 | 27 Pages |
Abstract
Improvement of copper deposit with additive addition.404
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
![Influence of additives selected calix[4]arenes on electroless copper plating using hypophosphite as reducing agent](/preview/png/5465643.png "First Page Preview: Influence of additives selected calix[4]arenes on electroless copper plating using hypophosphite as reducing agent")
Authors
N. M'hanni, M. Galai, T. Anik, M. Ebn Touhami, E.H. Rifi, Z. Asfari, R. Touir,