| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5468152 | Vacuum | 2017 | 4 Pages |
Abstract
The paper presents a high-rate method for metal coating deposition by the means of magnetron sputtering system (MSS) with liquid-phase target. Maximum copper deposition rate at a power density of 55Â W/cm2 is 200Â nm/s, which is twenty times higher than if an ordinary magnetron is used. The effect of material of the crucible on operation of MSS with liquid-phase target and copper coating deposition rate is studied. It is demonstrated that using the crucible with a lower emissivity allows the several-fold increase in deposition rate.
Related Topics
Physical Sciences and Engineering
Materials Science
Surfaces, Coatings and Films
Authors
Alena V. Yuryeva, Artyom S. Shabunin, Dmitry V. Korzhenko, Olga S. Korneva, Mikhail V. Nikolaev,