Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5468435 | Vacuum | 2017 | 8 Pages |
Abstract
Al0.24Ga0.76N thin film surfaces were etched with CF4 plasma, with and without the assistance of near-ultraviolet (UV) irradiation. The near-UV source was a black light lamp, which emitted wavelengths of 300-400Â nm. The chemical compositions and morphologies of surfaces etched under the two plasma conditions were compared, to clarify the effect of near-UV irradiation on the properties of the AlGaN surface. Near-UV irradiation during CF4 plasma etching reduced the amounts of F atoms, AlFx fluorides, and GaFx fluorides incorporated into the surface, and enhanced the amount of CFx fluorocarbons. Near-UV irradiation did not influence the depth distribution of incorporated fluorine-related impurities, or the degree of nitrogen deficiency caused in the surface. These compositional changes in the surface occurred irrespective of the gas pressure. Near-UV irradiation caused a significant change in the morphology of surfaces etched at high gas pressure (13Â Pa), as the etching time was increased to 60 and 100Â min. Near-UV irradiation did not change the morphologies of surfaces etched at lower gas pressures (1.3 and 6.7Â Pa), irrespective of etching time.
Related Topics
Physical Sciences and Engineering
Materials Science
Surfaces, Coatings and Films
Authors
Retsuo Kawakami, Masahito Niibe, Yoshitaka Nakano, Takashi Mukai,