Article ID Journal Published Year Pages File Type
5469498 Journal of Manufacturing Systems 2017 10 Pages PDF
Abstract
Topological data analysis (TDA) has emerged as one of the most promising approaches to extract insights from high-dimensional data of varying types such as images, point clouds, and meshes, in an unsupervised manner. To the best of our knowledge, here, we provide the first successful application of TDA in the manufacturing systems domain. We apply a widely used TDA method, known as the Mapper algorithm, on two benchmark data sets for chemical process yield prediction and semiconductor wafer fault detection, respectively. The algorithm yields topological networks that capture the intrinsic clusters and connections among the clusters present in the data sets, which are difficult to detect using traditional methods. We select key process variables or features that impact the system outcomes by analyzing the network shapes. We then use predictive models to evaluate the impact of the selected features. Results show that the models achieve at least the same level of high prediction accuracy as with all the process variables, thereby, providing a way to carry out process monitoring and control in a more cost-effective manner.
Related Topics
Physical Sciences and Engineering Engineering Control and Systems Engineering
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