Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5469734 | Procedia CIRP | 2016 | 5 Pages |
Abstract
This study investigates the effect of process parameters on the temperature and energy partition during micro-grinding by finite element modeling (FEM) simulation and experimental validation. Finite element model was is used to predict the workpiece and chip temperature under different grinding conditions by refining the micro-grinding temperature field. Based on detailed analysis and physics-based modeling, the temperature on workpiece and chips are predicted. The finite element modeling and experimental validation have been presented herein for the micro-grinding energy partition into chips with chip temperature consideration. The results show that the temperature and energy partition investigation can help optimize the grinding process for minimized thermal damages. The results indicate that the pursuit of reducing energy partition into workpiece can be achieved not only by improving grinding speed, but also by increasing the workpiece speed and reducing the depth of cut appropriately.
Related Topics
Physical Sciences and Engineering
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Authors
Zishan Ding, Beizhi Li, Omar Fergani, Yamin Shao, Steven Y. Liang,