Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
582091 | Journal of Hazardous Materials | 2009 | 6 Pages |
Abstract
Copper-surfactant wastewaters are often encountered in electroplating, printed circuit boards manufacturing, and metal finishing industries, as well as in retentates from micellar-enhanced ultrafiltration process. A low-cost three-dimensional steel wool cathode reactor was evaluated for electrolytic recovery of Cu ion from dilute copper solution (0.2Â mM) in the presence of sodium dodecyl sulfate (SDS), octylphenol poly (ethyleneglycol) 9.5 ether (TX), nonylphenol poly (oxyethylene) 9 ether (NP9) and polyoxyethylene (20) sorbitan monooleate (TW) and also mixed surfactants (anionic/nonionic). The reactor showed excellent copper recovery ability in comparison to a parallel-plate reactor. The reactor rapidly recovered copper with a reasonable current efficiency. 93% of copper was recovered at current density of 1Â AÂ mâ2 and pH 4 in the presence of 8.5Â mM SDS. Initial solution pH, cathodic current density, solution mixing condition, SDS concentration, and initial copper concentrations significantly influenced copper recovery. The copper recovery rate increased with an increase in aqueous SDS concentrations between 5 and 8.5Â mM. The influences of nonionic surfactants on Cu recovery from SDS-Cu solution depended not only on the type of surfactants used, but also on applied concentrations. From the copper recovery perspective, TX at 0.1Â mM or NP should be selected rather than TW, because they did not inhibit copper recovery from SDS-Cu solution.
Keywords
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Health and Safety
Authors
Shih-Hsien Chang, Kai-Sung Wang, Pei-I Hu, I-Chun Lui,