| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 615335 | Tribology International | 2011 | 8 Pages |
The simulation model of electrical contact resistance variation under various oxide fractions is constructed considering thermal–electrical coupled effects. The copper oxide is allocated on the contact area with various fractions by random distribution technique with finite element method. The contact degradations of experimental and analytical results are compared. The quantitative relation between insulation fraction and electrical resistance increment is analyzed.
► Simulation model is constructed considering thermal–electrical coupled effects. ► Copper oxide is allocated by the random distribution technique with FEM. ► Contact degradations of experimental and analytical results are compared. ► Relation between insulation fraction and electrical resistance is analyzed.
