| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 615902 | Tribology International | 2010 | 5 Pages |
Abstract
Chemical mechanical polishing (CMP) mechanisms of NiP coating plated on Al–Mg alloy substrates have been investigated with an X-ray photoelectron spectroscope (XPS). The XPS results indicate that after cleaning, the disk surface contains a thin layer of Ni(OH)2 and P2O3, followed by a thin NiO and P2O3 layer. It is also deduced that during polishing, the disk surface has an oxidization layer with Ni2+ and P3+ species. The experimental investigations reveal that the CMP mechanisms involve a simultaneous process of surface chemical passivation and nano-particle wear.
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Physical Sciences and Engineering
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Authors
Zuqiang Qi, Weiming Lee,