| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 615956 | Tribology International | 2010 | 8 Pages |
Abstract
A phenomenological model of polishing hemispherical silicon asperities with spherical diamond abrasives is presented. Removal of the asperity material is quantitatively determined by a removal rate constant K. It is based on our molecular dynamics (MD) simulation studies considering the probability of removal of asperity atoms by an abrasive. The dependence of the removal rate constant K on the diameter and velocity of abrasives, number of asperities and abrasives per unit area, and cutting depth has been investigated. The rate constant K is found to be insensitive to the density of asperities, but linearly dependent on the density of abrasives.
Keywords
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Colloid and Surface Chemistry
Authors
Paras M. Agrawal, R. Narulkar, S. Bukkapatnam, L.M. Raff, R. Komanduri,