| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 618007 | Wear | 2011 | 5 Pages |
Surface modified SiO2 particles in an aqueous environment with γ-aminopropyl triethoxysilane (APTS)/methyl trimethoxysilane (MTMOS) are introduced as abrasive in the slurry. The modified silica particles are characterized by Particle Size/Zeta Potential Analysis, Fourier Transform Infrared Spectroscopy (FTIR), Thermal Gravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC). In addition, the enhancement of polishing rate owning to the modified silicon particles in silicon wafer Chemical Mechanical Polishing (CMP) is observed.
► Silane coupling agents with different functional groups and hydrophilicity (γ-aminopropyl triethoxysilane (APTS) and methyl trimethoxysilane (MTMOS)) are chosen to modify silica particles to be used in final polishing of silicon wafers. ► Higher Material Removal Rate (MRR) and more excellent surface with lower Roughness (Ra) and Peak-to-Valley value (PV) are obtained, because silane modified abrasive particles have better suspension stability and more compatible chemical reactivity. ► Different polishing mechanisms of two modified silica abrasive are demonstrated.
