| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 618198 | Wear | 2011 | 8 Pages |
Abstract
⺠Bulk DPD Cu with nano-scale twin bundles embedded in nano-sized grains. ⺠DPD Cu exhibits an enhanced wear resistance relative to coarse-grained Cu. ⺠Worn subsurface structure shows a vortex zone within an ultrafine grain layer. ⺠Plastic deformation induced grain refinement plays an important role in CG Cu. ⺠DPD Cu involves dynamic recrystallization and subsequent plastic deformation.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Colloid and Surface Chemistry
Authors
B. Yao, Z. Han, Y.S. Li, N.R. Tao, K. Lu,