| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 618617 | Wear | 2010 | 7 Pages |
Abstract
ⶠMore grain pulling-out in equiaxed grain (EQ) than in elongated grain (EL) of S-SiC. ⶠGrain pulling-out is related to aspect ratio and grain diameter. ⶠOnly plastic deformation in EL during polishing. ⶠBrittle fracture during grinding while plastic deformation during polishing in EL.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Colloid and Surface Chemistry
Authors
Jianqin Gao, Jian Chen, Guiling Liu, Yongjie Yan, Xuejian Liu, Zhengren Huang,