A simple method for fabricating microwire tetrode with sufficient rigidity and integrity without a heat-fusing process

Heat-fusing is a common process for fabricating microwire tetrodes. However, it is time-consuming, and the high-temperature treatment can easily cause the insulation of the microwire to overheat leading to short circuits. We herein provide a simple, fast method to fabricate microwire tetrodes without the heat-fusion process. By increasing the twisting density, we were able to fabricate tetrodes with good rigidity and integrity. This kind of tetrode showed good recording quality, penetrated the brain surface easily, and remained intact after chronic implantation. This method requires only general laboratory tools and is relatively simple even for inexperienced workers.

Research highlights▶ Increase twisting density could increase the rigidity and integrity of the tetrode. ▶ Skip the heat-fusing and post-coating processes. ▶ Only general laboratory tools such as hemostats and magnetic stirrer needed.