Formation of a defect-free Pd–Cu–Ni ternary alloy membrane on a polished porous nickel support (PNS)

In order to decrease its resistance we enlarged the pore size of a porous nickel support (PNS) by using nickel powder with a larger particle size. The gas permeation test showed that this increased the gas permeation flux compared with the previous support. To make up for the various disadvantages, such as the enlarged surface roughness and pore size, a polishing process was introduced with sandpaper, followed by wet polishing with alumina powder. The polishing treatment was very effective in leveling off the surface of the porous nickel support, but it almost completely plugged the pores. Those pores blocked by the polishing process could be regenerated during Cu-reflow at 973 K by the upward diffusion of nickel and in this way a 12 μm defect-free Pd–Cu–Ni ternary alloy film was formed on the polished porous nickel support. Furthermore, we were able to obtain a three times higher hydrogen permeability than that reported in previous studies, because of the decreased support resistance of the porous nickel support.