Thermal performance of a carbon fiber composite material heat sink in an FC-72 thermosyphon

This study analyzes the use of a carbon fiber epoxy heat sink for evaporator surface enhancement in a FC-72 thermosyphon. The pin-fin heat sink features 945 small-cross-section (1.27 mm by 0.965 mm) fins fabricated with an integral base plate. These fins have a high thermal conductivity (500 W/m K) along the length of the fin. The influence of heat load, thermosyphon fill volume, and condenser operating temperature on the overall thermal performance is examined. The results of this experiment provide significant insight into the possible implementation and potential benefits of carbon-fiber heat sink technology in two-phase flow leading to significant improvements in thermal management strategies for advanced electronics.