Enabling thin silicon technologies for next generation c-Si solar PV renewable energy systems using synchrotron X-ray microdiffraction as stress and crack mechanism probe

With this technique, we aim to gain fundamental understanding of the stress magnitudes as well as characteristics that could lead to crack initiation and propagation. We have thus far found evidences of both extrinsic (device related) as well as intrinsic (crystallographic) nature of silicon cracking, which further confirm that the control of mechanical stress is the key to enable thin silicon solar cell technologies in the coming years. This study represents an ongoing high impact technology research that addresses real and important fundamental materials issue facing the crystalline silicon solar PV industry and contributes directly to the industry drive to reduce cost of PV systems to grid parity.