Article ID Journal Published Year Pages File Type
654925 International Communications in Heat and Mass Transfer 2007 9 Pages PDF
Abstract

The paper is focused on the investigation of numerical simulation of stacked two-layer microchannel heat sink with enhanced mixing passive microstructure. In contrast to the smooth microchannel studies in the literature, the microchannel with embedded passive microstructure is chosen. The computational fluid dynamics (CFD) will be used to simulate the flow and heat transfer in a stacked two-layer microchannels with multiple MEMS easy-processing passive microstructures. To simulate the conjugated heat transfer among the heatsink and fluid, the three-dimensional conjugated model is used to solve this problem. The important parameters (e.g. the ratio of embedded structure height to microchannel height and fluid property) are investigated. The ratio of embedded structure height to microchannel height is changed from 0.13 to 0.26. The microchannel Reynolds number is fixed at 14.8. The stacked microchannel with passive structures has better performance than the smooth microchannels.

Related Topics
Physical Sciences and Engineering Chemical Engineering Fluid Flow and Transfer Processes
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